1. 2. 3. material content data sheet sales product name bsz019n03ls issued 14. august 2015 ma# ma001025838 package pg-tsdson-8-26 weight* 36.77 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.629 1.71 1.71 17110 17110 leadframe inorganic material phosphorus 7723-14-0 0.002 0.01 67 non noble metal zinc 7440-66-6 0.010 0.03 268 non noble metal iron 7439-89-6 0.197 0.54 5351 non noble metal copper 7440-50-8 7.988 21.73 22.31 217265 222951 wire noble metal gold 7440-57-5 0.028 0.08 0.08 759 759 encapsulation organic material carbon black 1333-86-4 0.037 0.10 1002 plastics epoxy resin - 1.897 5.16 51602 inorganic material silicondioxide 60676-86-0 16.486 44.83 50.09 448386 500990 leadfinish non noble metal tin 7440-31-5 0.400 1.09 1.09 10885 10885 plating noble metal silver 7440-22-4 0.020 0.06 0.06 553 553 solder noble metal silver 7440-22-4 0.023 0.06 637 non noble metal tin 7440-31-5 0.019 0.05 510 non noble metal lead 7439-92-1 0.895 2.43 2.54 24330 25477 heatspreader inorganic material phosphorus 7723-14-0 0.001 0.00 32 non noble metal zinc 7440-66-6 0.005 0.01 128 non noble metal iron 7439-89-6 0.094 0.26 2556 non noble metal copper 7440-50-8 3.816 10.38 10.65 103784 106500 heat sink clip inorganic material phosphorus 7723-14-0 0.001 0.00 34 non noble metal zinc 7440-66-6 0.005 0.01 138 non noble metal iron 7439-89-6 0.101 0.28 2755 non noble metal copper 7440-50-8 4.112 11.18 11.47 111848 114775 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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